The SilverStone XED120S is presented as an interesting cooler due to its origins in industrial server use, which have been converted for consumer applications. Its design incorporates six 6mm diameter heatpipes and a 30mm thick fan, aiming to maximize performance within its form factor.
The specifications listed for the unit include compatibility with Intel LGA1851/1700 and AMD Socket AM5/AM4. The cooler has a CPU TDP rating of 240W and a net weight of 972g. Materials used include copper heat pipes with aluminum fins.
Performance details highlight the fan dimensions at 120mm (W) x 30mm (H) x 120mm (D). The fan can operate at speeds ranging from 800 to 3000 RPM, operating on a 12V rated voltage and utilizing a 4 pin PWM connector. It features dual ball bearings, boasts an MTTF of 70,000 hours, and provides a maximum airflow of 102CFM.
The physical design features a matte silver top cover, complementing the nickel-plated heatpipes and contact plate, while also offering corrosion protection.
In terms of packaging, the XED120S is housed in a plain white box, featuring the SilverStone logo and product information. The source notes that this simple package design may not be considered attractive for retail display, though it is attributed to its original server purpose.
The unboxing process includes a white cardboard box containing mounting brackets, accessories, and the user manual. Inside, the XED120S unit is found wrapped in plastic film and held between two plastic holders.
Testing results show that the cooler performed well when cooling a midrange AMD CPU during both idle and load tests, generating a substantial amount of airflow with only one fan operating.
Despite its solid performance as a cool cooler, several potential improvements were noted. One significant downside is the noise level it produces; the market remains highly competitive for quieter options, especially under full load.
Other suggested enhancements include wrapping the fan PWM cable with electrical insulation for better aesthetics, adding a tube of thermal paste to facilitate multiple installations, and improving the package design’s visual appeal.
Source: APH Networks